Introduction
1. The product is DFN5060-8LN+P dual-core frame sealing package. Compared with DFN3333 (3.3X3.3mm) package, which have better heat dissipation capacity, stronger output power and current. It’s more suitable for fans with higher power requirements;
2. The product has the characteristics of strong over-current capability, lower thermal resistance and a wider range of SOA;
3. NMOS and PMOS are sealed to simplify the bridge structure while retaining the flexibility of engineers' application;
4. The Vds can withstand voltages of 30V, 60V, and 100V respectively. It applies to the 12V, 24V, and 48V fan systems.