Introduction
In recent years, with the increasing demand for higher power in serve power supply and the trend of minimizing component size, the demand for heat dissipation is becoming increasing challenging. YangJie Technology launched TSMT8 package MOSFET with N+P dual chip assembled, which simplifies the product circuit bridge structure while retaining the flexibility for engineers' applications, and can greatly save the PCB size area, which is suitable for various types of cooling fan products with narrow internal space.
Features
1. Compared with DFN3333( 3.3 X 3.3 mm) package , this product with smaller size (2.8 X 2.9mm) by using PDFN3030-8L( TSMT8) package of N+P dual-chip assembled, which is more suitable for small fans with extremely requirement on size.
2. The product has the characteristics of strong over-current capability, low thermal resistance and wider range of SOA;
3. NMOS and PMOS are assembled to simplify the circuit bridge structure while retaining the flexibility for engineers' applications.