Introduction
1.Withultra-thinpackageshape,itcanbeusedinminiaturizedandthincircuits;
2.Thebottom sideofthepackagehasaheatsink,whichhasexcellentheat
dissipationperformance;
3.Therearemanykindsofpackagingchips,includingGPP,DB,Schottky,FRED,
TVSandotherchips;
4.Theproductismadeofenvironment-friendlymaterialsandmeetsRoHSstandards;
5. Products are widely used in secondary rectifier circuits, converters, freewheeling diodes, AC/DC power protection and so on.
Features
1. Excellent heat dissipation performance: the back pad has large area, good heat dissipation performance and strong flow capacity, which can meet the requirements of high-temperature applications
2、Thin package shape :the package shape is thinner than SOD-123FL package and meets the development trend of packaging thinness